MicroLink Technology

MicroLink Data Centers Technology dossier

MicroLink's
Technology
Development

Scalable solutions developed with partners and friends.

Sectional drawing through a MicroLink data hall with adjacent greenhouse, engine enclosure, heat delivery, gas, duct and chilled water routes marked
L1 SERVER LOOP L3 HOST DELIVERY EXCH A EXCH B SERVER RACK COOLER DIGESTER 70 °C (158 °F) 35 °C (95 °F) 55 °C (131 °F) 10 °C (50 °F)
Supply side, cool loopReturn side, recovered heat
MICROLINK DEVELOPED Control, monitoring and management software System and solution design Generation solutions Heat recovery solutions STANDARDISED WITH PARTNERS Cooling plant Power modules IT hardware Vertiv and other leading manufacturers

Who we are

MicroLink Data Centers builds high density, liquid cooled compute inside industrial host partner facilities: places that already hold the power and already buy the heat. Almost every watt a chip draws leaves the silicon as heat. Everyone else throws it away. We treat it as a second product.

What we do

We develop and operate compute across three scales on one shared stack: a 50 kW edge block, a 1.25 MW pod, and campuses from 10 MW up to 1 GW. No other company is developing a continuous range across these applications. Every scale runs the same software, the same thermal philosophy and the same dry cooler backed architecture, so what is proven at one scale carries to the next.

How we do it

We standardise the hardware and develop the layer above it. Cooling distribution, power modules and IT hardware are standardised with Vertiv and other leading manufacturers. MicroLink's own development, and its IP, sits in control, monitoring and management software, in system and solution design for compute inside industrial sites, in 800 V DC power, and in the systems that couple generation optimisation and heat recovery to compute. Delivered performance is reported as ERE alongside PUE, from live metering.

Solutions Technology under development

Three families,
one stack

MicroLink data center supplying recovered heat through integration kits to a greenhouse, brewery, digester and food processing facility

Recovery

RC 01

Metered heat delivery interface

One metered exchanger between MicroLink plant and the host partner's systems: process hot water, digesters, district heat, greenhouses. The commercial and physical boundary in a single engineered product.

Solution detail
RC 02

High grade return water

Direct to chip liquid cooling engineered from the first decision for recovery, returning water at 40 to 65°C (104 to 149°F) matched to real industrial demand.

Solution detail
RC 03

Heat pump temperature boosting

Conditioning stage heat pumps lift return water to the temperature the host process actually needs, from digester duty at 35 to 55°C (95 to 131°F) up to cleaning and pasteurisation duty at 60 to 90°C (140 to 194°F).

Solution detail
RC 04

Demand matching and storage

Buffering and demand matching between a constant compute heat source and a variable industrial heat user, so compute never waits on thermal demand.

Solution detail
RC 05

Process integration kits

Integration engineered per host industry: district networks, digesters, brewery hot water and cleaning, pasteurisation, greenhouse climate.

Solution detail
RC 06

Loop closure and by product return

Host by products return to the data center as supplementary resource: biogas to power, CO2 to cooling or plant growth, chilled water to the cooling system.

Solution detail

Generation

GN 03

Grid aware operation

Curtailment capture, demand response and constrained grid operation, so compute lands in markets where new utility load waits years.

Solution detail
GN 04

Waste to energy integration

Compute taking the electrons from upgraded waste to energy facilities, with recovered heat returned to the process.

Solution detail
GN 05

Heat to power

Organic Rankine and other heat driven cycles regenerating electricity from the compute heat stream, turning recovered heat into a second power product.

Solution detail

Optimisation

OP 03

Node Intelligence

Fleet analytics: cross fleet learning, predictive maintenance and benchmarking across every MicroLink deployment.

Solution detail
OP 04

MCS platform

The management and control platform tying the suite together, named in the ML-IND-001 filing as the adaptive controller balancing IT load, thermal export and host demand signal in real time.

Solution detail
OP 06

Digital twin and forecasting

Site models and forecasting for industrial thermal demand, weather, price and grid state, feeding every dispatch decision.

Solution detail

Research

We believe in the academic endeavor and we enjoy participating in it.

ReferenceTopicWithStatus
R1Objective Functions of Data CentersWhat a data center is optimised for, and who decides. Financial return and community impact as competing terms in one model.Rice University, Prof. Laura SchaeferActive
R2Cascade Design for Low Grade HeatWhat temperature goes to which use, in what order, and where storage sits between compute load and heat demand.Rice University, Prof. Laura SchaeferActive
R3Distributed Design OptimizationHow far apart nodes can sit and still behave as one data center, on the compute, power and thermal sides.Rice University, Prof. Laura SchaeferActive

RC 01 Solution detail

Metered heat
delivery interface

One metered exchanger between MicroLink plant and the host partner's systems: process hot water, digesters, district heat, greenhouses. The commercial and physical boundary in a single engineered product.

IP position

Developed. IP submitted 2026, patent pending. Summary on the overview.

All solutions
Process diagram of metered heat delivery: the server loop through the exchanger and inline meter into the host partner process, with the dry cooler path
Elevation drawing of the metered heat interface skid: plate exchanger, inline meter and valves at the ownership boundary

What is new here

  • A standard, meterable boundary product for delivered heat where the industry has ad hoc engineering
  • Heat accounting built for ERE reporting alongside PUE from live metering
$85k to $190kFuel displaced, MW yr
0.9 MWThermal per MW IT
LiveERE with PUE

RC 02 Solution detail

High grade return water

Direct to chip liquid cooling engineered from the first decision for recovery. Water leaves the racks at 65 °C (149 °F), hot enough for pasteurisation, clean in place, mash heating and low temperature district heat, and comes back from the host partner at 40 °C (104 °F).

IP position

Developed. IP submitted 2026, patent pending. Summary on the overview.

All solutions
Process diagram of high grade return water: direct to chip liquid cooling returning water at 40 to 65 degrees Celsius to industrial demand
Section drawing of a liquid cooled data hall with rooftop dry coolers and warm return pipework

What is new here

  • Cooling designed backwards from the heat user's temperature requirement, not forwards from the chip
  • Dry coolers sized for the full load carry whatever the host partner does not take, hour by hour
  • The loop upstream of the boundary, where RC 01 is the boundary itself
  • Return temperature set by the host process, then the cold plate, pump and CDU sized to hold it
65 °C (149 °F)Return from chip
ZeroPrior topologies
100%Dry cooler backed

RC 03 Solution detail

Heat pump temperature boosting

Conditioning stage heat pumps lift return water to the temperature the host process actually needs, from digester duty at 35 to 55 °C (95 to 131 °F) up to cleaning and pasteurisation duty at 60 to 90 °C (140 to 194 °F).

IP position

In development. IP to be submitted in 2027. Summary on the overview.

All solutions
Process diagram of heat pump boosting: buffer tanks either side of the heat pump lifting 65 to 85 degrees Celsius
Plant room section: heat pump units flanked by buffer vessels between data hall and host process

What is new here

  • Heat pump integration sized against a live compute heat source rather than ambient
  • Temperature upgrade selected per host process, not per industry rule of thumb
35 to 90 °CRange served
Up to 6.0Heat pump COP
60 MWProven, Hamburg

RC 04 Solution detail

Demand matching and storage

Buffering and demand matching between a constant compute heat source and a variable industrial heat user, so compute never waits on thermal demand.

IP position

In development. IP to be submitted in 2026. Summary on the overview.

All solutions
Process diagram of thermal storage matching constant compute heat to variable host demand with the dry cooler balance
Elevation drawing of twin thermal storage tanks between the data hall and the host facility

What is new here

  • Storage sizing method and demand forecasting for industrial thermal loads
  • Charge and discharge control against host process schedules
  • Compute never waits on thermal demand
70%Demand swing buffered
30 sFailover bridge
8 kLMinimum store

RC 05 Solution detail

Process integration kits

Integration engineered per host industry: greenhouse climate, brewery hot water and cleaning, digester heating and food processing.

IP position

In development. IP to be submitted in 2026. Summary on the overview.

All solutions
Process diagram of one architecture integrating greenhouse, brewery, digester and food processing hosts through integration kits
Elevation lineup of host types: greenhouses, brewery, digester and containerised data hall on one pipe run

What is new here

  • An embodiment library spanning wastewater treatment, brewing, controlled environment agriculture and food processing
  • One architecture proven across four host process families
4Host families
1Architecture
35 to 90 °CDelivery range

RC 06 Solution detail

Loop closure and by product return

Host by products return to the data center as supplementary resource: biogas to power, CO2 to plant growth, chilled water to the cooling system.

IP position

Developed. IP submitted 2026, patent pending. Summary on the overview.

All solutions
Process diagram of closed loop exchange: heat delivery out, biogas to power, CO2 to growth and chilled water returning
Section drawing of closed loop returns: gas to engine, duct to greenhouse, chilled water back to the hall

What is new here

  • Closed loop energy cycling between compute and host, metered in both directions
  • By product paths designed into the system architecture from the first line
3Return paths
2 wayMetered exchange

GN 03 Solution detail

Grid aware operation

Curtailment capture, demand response and constrained grid operation, so compute lands in markets where new utility load waits years.

IP position

In development. IP to be submitted in 2027. Summary on the overview.

All solutions
Process diagram of grid aware operation: grid, transformer, switchgear, battery storage and compute load under grid signals
Sectional elevation through a MicroLink data hall showing rooftop chiller plant, riser pipework and liquid cooled rack rows

What is new here

  • Compute sited where the grid has headroom today, not where it will have headroom after an interconnection queue
  • Curtailed and constrained energy taken as a fuel rather than treated as a discount
  • Dispatchable load that responds to grid signals in both directions, with the thermal side buffered so the host process does not see the swing
2 wayGrid signals
3Dispatchable load

GN 04 Solution detail

Waste to energy integration

Compute taking the electrons from upgraded waste to energy facilities, with recovered heat returned to the process.

IP position

In development. IP to be submitted in 2027. Summary on the overview.

All solutions
Process diagram of waste to energy integration: power to the data center, recovered heat returned to the plant
Elevation drawing of a waste to energy facility bridged to a containerised data hall campus

What is new here

  • Placeholder: facility upgrade model and offtake structure
  • Placeholder: firm baseload pairing with compute load
FirmBehind the meter
2 wayPower in, heat back

GN 05 Solution detail

Heat to power

Organic Rankine and other heat driven cycles regenerating electricity from the compute heat stream, turning recovered heat into a second power product.

IP position

In development. IP to be submitted in 2027. Summary on the overview.

All solutions
Process diagram of heat to power: the ORC module and generator converting 65 degree Celsius heat with the condenser
Elevation drawing of a heat to power module: organic Rankine skid feeding from the data hall

What is new here

  • The one generation route that runs on the same recovered heat as the delivery business, not alongside it
  • Cycle selected against the delivered heat grade, with the dry cooler path carrying whatever the cycle does not take
  • Generation and delivery draw on the same recovered heat stream, so the two products are sized against one thermal budget
65 °C (149 °F)Input heat
2ndPower product

OP 03 Solution detail

Node Intelligence

Fleet analytics: cross fleet learning, predictive maintenance and benchmarking across every MicroLink deployment.

IP position

In development. IP to be submitted in 2026. Summary on the overview.

All solutions
Process diagram of Node Intelligence: telemetry up from three sites, learning back down
Data hall section with telemetry gathered from every rack to a roof mast

What is new here

  • Every deployment produces telemetry that improves the design and control of the next one
  • Failure signatures and performance drift detected across the fleet rather than at one site in isolation
  • Benchmarking against measured ERE and PUE from live metering, not against design assumptions
24Fleet lessons
5Sites in the loop
16Field reports

OP 04 Solution detail

MCS platform

The management and control platform tying the suite together, named in the ML-IND-001 filing as the adaptive controller balancing IT load, thermal export and host demand signal in real time.

IP position

Developed. IP submitted 2026, patent pending. Summary on the overview.

All solutions
Process diagram of the MCS platform coordinating compute, cooling, heat delivery and the host signal with ERE and PUE live
Control room section: operator desks and display wall adjoining the data hall

What is new here

  • ERE reported alongside PUE as a live operational metric at every site
  • The control layer of a filed patent architecture, not a roadmap item
  • One controller across compute, cooling, heat delivery and host signal, so the trade offs resolve in one place rather than between four vendors' systems
4Systems, one controller
LiveERE with PUE
ML-IND-001Filed controller

OP 06 Solution detail

Digital twin and forecasting

Site models and forecasting for industrial thermal demand, weather, price and grid state, feeding every dispatch decision.

IP position

In development. IP to be submitted in 2026. Summary on the overview.

All solutions
Process diagram of the live site and its digital twin exchanging telemetry and forecasts
The facility drawn solid beside its dashed digital twin

What is new here

  • Site models built per host industry, so the forecast inputs match the process being served
  • Thermal demand, weather, price and grid state forecast together, because dispatch depends on all four at once
  • The twin corrected against the live site from measured data, rather than left as a design model
2 wayTelemetry and forecasts
3Forecast inputs

Reference Partners, technologies, research

What we build on

The manufacturers we standardise with, the technologies we work with, and the research behind the programme.

Partners

MANUFACTURING

Vertiv

Cooling distribution, CDUs, dry coolers and power modules standardised against MicroLink reference designs.

MANUFACTURING

Leading manufacturers

Additional manufacturing and component partners, named as disclosure clears.

HOST PARTNERS

Industrial and district energy

Host partner categories across wastewater treatment, food and beverage, and district energy networks.

Long section through a MicroLink data hall delivering recovered heat to an adjacent greenhouse, with hot and cool loops and the dry cooler rejection path